Copper Plating Additive

Copper plating additives are commonly used in large-scale instruments and equipment such as nuclear magnetic resonance (NMR), gas chromatography-mass spectrometry (GCMS), mass spectrometry (MS), infrared spectroscopy (FTIR), X-ray fluorescence analyzer (XRF), liquid chromatography-mass spectrometry (LCMS), and thermogravimetric analysis (TGA).
Common types
Copper salts: Copper sulfate, copper chloride, copper nitrate, etc., provide the copper ions required for copper plating.
Complex agents: potassium sodium tartrate, sodium citrate, disodium ethylenediaminetetraacetic acid, triethanolamine, etc., can make the coating crystal fine and bright, and prevent copper ions from forming precipitates under alkaline conditions.
Reducing agents: formaldehyde, glyoxal, glyoxylic acid, hypophosphate, etc., can reduce copper ions to metallic copper.
Promoters: Sodium polydisulfide propane sulfonate, sodium 3-mercapto-1-propane sulfonate, etc., can increase the cathode current density and make the coating uniform and fine.
Inhibitor: commonly used polyethylene glycol, which can adsorb on the surface of the plating piece, reduce the diffusion of brighteners and other additives, and achieve a leveling effect.